i ntegrated c ircuits d ivision lba110 dual pole optomos ? relay www.ixysic.com ds-lba110-r09 1 part # description lba110 8-pin dip (50/tube) lba110s 8-pin surface mount (50/tube) lba110str 8-pin surface mount (1,000/reel) LBA110P 8-pin flat pack (50/tube) LBA110Ptr 8-pin flat pack (1,000/reel) parameter ratings units blocking voltage 350 v p load current 120 ma rms / ma dc on-resistance (max) 35 ? applications features description approvals ordering information pin configuration ? 3750v rms input/output isolation ? 100% solid state ? low drive power requirements (ttl/cmos compatible) ? arc-free with no snubbing circuits ? fcc compatible ? vde compatible ? no emi/rfi generation ? machine insertable, wave solderable ? telecommunications ? telecom switching ? tip/ring circuits ? modem switching (laptop, notebook, pocket size) ? hook switch ? dial pulsing ? ground start ? ringing injection ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment-patient/equipment isolation ? security ? aerospace ? industrial controls lba110 comprises two independent 350v, 120ma, 35 ? solid state relays: one single-pole, normally open (1-form-a) relay and one single-pole, normally closed (1-form-b) relay. lba110 is designed to provide an ideal solution where a complementary form-a/form-b relay pair is required. ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component tuv certificate b 09 07 49410 004 e 3 pb switching characteristics of normally closed devices form-b i f 10% 90% i load t on t off form-a i f i load 10% 90% t on t off switching characteristics of normally open devices 1 2 3 4 8 7 6 5 + control - normally closed C control - normally closed + control - normally open C control - normally open normally closed pole normally open pole
i ntegrated c ircuits d ivision www.ixysic.com 2 r09 lba110 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. parameter conditions symbol min typ max units output characteristics load current continuous 1 -i l - - 120 ma rms / ma dc peak t = 10ms i lpk - - 350 ma p on-resistance i l =120ma r on -2535 ? off-state leakage current v l =350v p i leak --1 ? a switching speeds turn-on i f =5ma, v l =10v t on --3 ms turn-off t off --3 output capacitance v l =50v, f=1mhz c out -25- pf input characteristics input control current to activate i l =120ma i f --2 ma input control current to deactivate - i f 0.4 0.7 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a common characteristics input to output capacitance - c i/o -3- pf 1 if both poles operate the load current must be derated so as not to exceed the package power dissipation value. parameter ratings units blocking voltage 350 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 800 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / oc 2 derate linearly 6.67 mw / oc absolute maximum ratings @ 25oc electrical characteristics @ 25oc
i ntegrated c ircuits d ivision lba110 www.ixysic.com 3 r09 form-a/form-b performance data @25oc (unless otherwise noted)* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. form-a performance data @25oc (unless otherwise noted)* 35 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.25 led forward voltage drop (v) device count (n) typical led forward voltage drop (n=50, i f =5ma) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 temperature (oc) led forward voltage drop (v) typical led forward voltage drop vs. temperature i f =50ma i f =30ma i f =20ma i f =10ma i f =5ma 0.45 1.05 1.65 0.75 1.35 turn-on time (ms) device count (n) 25 20 15 10 5 0 form-a typical turn-on time (n=50, i f =5ma, i l =120ma dc ) 0.12 0.28 0.44 0.60 0.52 0.36 0.20 turn-off time (ms) device count (n) 25 20 15 10 5 0 form-a typical turn-off time (n=50, i f =5ma, i l =120ma dc ) 35 30 25 20 15 10 5 0 19.5 21.5 23.5 25.5 20.5 22.5 24.5 device count (n) form-a typical on-resistance distribution (n=50, i f =5ma, i l =120ma dc ) on-resistance ( : ) 0.65 1.17 1.69 0.91 1.43 1.95 led current (ma) device count (n) 25 20 15 10 5 0 form-a typical i f for switch operation (n=50, i l =120ma dc ) 25 20 15 10 5 0 0.65 1.17 1.69 0.39 0.91 1.43 1.95 led current (ma) device count (n) form-a typical i f for switch dropout (n=50, i l =120ma dc ) 35 30 25 20 15 10 5 0 400 440 480 520 420 460 500 device count (n) form-a typical blocking voltage distribution (n=50) blocking voltage (v p )
i ntegrated c ircuits d ivision www.ixysic.com 4 r09 lba110 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. form-a performance data @25oc (unless otherwise noted)* led forward current (ma) turn-on time (ms) 0 5 1015202530354045 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 50 form-a typical turn-on time vs. led forward current (i l =120ma dc ) led forward current (ma) turn-off time (ms) 0 5 1015202530354045 0.220 0.215 0.210 0.205 0.200 0.195 0.190 0.185 0.180 0 50 form-a typical turn-off time vs. led forward current (i l =120ma dc ) led current (ma) -40 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 temperature (oc) form-a typical i f for switch operation vs. temperature (i l =120ma dc ) led current (ma) -40 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 temperature (oc) form-a typical i f for switch dropout vs. temperature (i l =120ma dc ) turn-on time (ms) -40 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -20 0 20 40 60 80 100 temperature (oc) form-a typical turn-on time vs. temperature (i l =120ma dc ) i f =5ma i f =10ma i f =20ma turn-off time (ms) -40 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -20 0 20 40 60 80 100 temperature (oc) form-a typical turn-off time vs. temperature (i f =5ma, i l =120ma dc ) temperature (oc) on-resistance ( : ) -40 60 50 40 30 20 10 0 -20 0 20 40 60 80 100 form-a typical on-resistance vs. temperature (i f =5ma, i l =120ma dc ) -4 -3 -1 -2 0 1 2 3 4 load voltage (v) load current (ma) 150 100 50 0 -50 -100 -150 form-a typical load current vs. load voltage (i f =5ma) -40 480 470 460 450 440 430 420 -20 0 20 40 60 80 100 temperature (oc) form-a typical blocking voltage vs. temperature blocking voltage (v p ) leakage (a) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 -20 0 20 40 60 80 100 form-a typical leakage vs. temperature measured across pins 5&6 temperature (oc) time load current (a) 10s 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1ms 100s 100ms 1s 10ms 10s 100s energy rating curve load current (ma) 180 160 140 120 100 80 60 40 20 0 form-a maximum load current vs. temperature -40 -20 0 20 40 60 80 120 100 temperature (oc) i f =20ma i f =10ma i f =5ma
i ntegrated c ircuits d ivision lba110 www.ixysic.com 5 r09 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. form-b performance data @25oc (unless otherwise noted)* 0.25 0.45 0.65 0.35 0.55 0.75 turn-on time (ms) device count (n) 25 20 15 10 5 0 form-b typical turn-on time (n=50, i f =5ma, i l =120ma dc ) 0.40 0.72 1.04 0.88 0.56 0.24 turn-off time (ms) device count (n) 25 20 15 10 5 0 form-b typical turn-off time (n=50, i f =5ma, i l =120ma dc ) 25 20 15 10 5 0 25.5 27.5 29.5 31.5 26.5 28.5 30.5 device count (n) on-resistance ( : ) form-b typical on-resistance distribution (n=50, i f =5ma, i l =120ma dc ) 25 20 15 10 5 0 0.7 1.1 1.5 1.9 0.9 1.3 1.7 led current (ma) device count (n) form-b typical i f for switch operation (n=50, i l =120ma dc ) 25 20 15 10 5 0 0.9 1.3 1.7 0.7 1.1 1.5 1.9 led current (ma) device count (n) form-b typical i f for switch dropout (n=50, i l =120ma dc ) 30 25 20 15 10 5 0 365 385 405 425 375 395 415 device count (n) blocking voltage (v p ) form-b typical blocking voltage distribution (n=50) led forward current (ma) turn-on time (ms) 0 5 1015202530354045 0.42 0.41 0.40 0.39 0.38 0.37 0.36 0.35 0.34 50 form-b typical turn-on time vs. led forward current (i l =120ma dc ) led forward current (ma) turn-off time (ms) 0 5 1015202530354045 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 50 form-b typical turn-off time vs. led forward current (i l =120ma dc ) led current (ma) -40 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 form-b typical i f for switch operation vs. temperature (i l =120ma dc ) temperature (oc) led current (ma) -40 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 form-b typical i f for switch dropout vs. temperature (i l =120ma dc ) temperature (oc) turn-on time (ms) -40 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -20 0 20 40 60 80 100 temperature (oc) form-b typical turn-on time vs. temperature (i f =5ma, i l =120ma dc ) turn-off time (ms) -40 1.2 1.0 0.8 0.6 0.4 0.2 0 -20 0 20 40 60 80 100 form-b typical turn-off time vs. temperature (i l =120ma dc ) i f =5ma i f =10ma i f =20ma temperature (oc)
i ntegrated c ircuits d ivision www.ixysic.com 6 r09 lba110 form-b performance data @25oc (unless otherwise noted)* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. -40 60 50 40 30 20 10 0 -20 0 20 40 60 80 100 form-b typical on-resistance vs. temperature (i f =5ma, i l =120ma dc ) on-resistance ( : ) temperature (oc) load voltage (v) load current (ma) 150 100 50 0 -50 -100 -150 -4 -3 -1 -2 0 1 2 3 4 form-b typical load current vs. load voltage (i f =5ma) -40 415 410 405 400 395 390 385 380 375 -20 0 20 40 60 80 100 form-b typical blocking voltage vs. temperature blocking voltage (v p ) temperature (oc) leakage (a) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 -20 0 20 40 60 80 100 form-b typical leakage vs. temperature measured across pins 5&6 (i f =5ma) temperature (oc) time load current (a) 10s 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1ms 100s 100ms 1s 10ms 10s 100s energy rating curve load current (ma) 180 160 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 120 100 form-b maximum load current vs. temperature (i f =0ma) temperature (oc)
i ntegrated c ircuits d ivision lba110 www.ixysic.com 7 r09 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating lba110 / lba110s / LBA110P msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time lba110 / lba110s 250oc for 30 seconds LBA110P 260oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision www.ixysic.com 8 r09 lba110 mechanical dimensions dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005) dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.102 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.0127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1 dimensions mm (inches) pcb land pattern 9.398 0.127 (0.370 0.005) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.254 (0.300 0.010) 0 min / 0.102 max (0 min / 0.004 max) 2.286 max. (0.090 max.) 0.203 0.013 (0.008 0.0005) 0.635 0.127 (0.025 0.005) 9.652 0.381 (0.380 0.015) 0.457 0.076 (0.018 0.003) 2.159 0.025 (0.085 0.001) 2.54 (0.10) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 0.864 0.120 (0.034 0.004) pin 1 lba110 lba110s LBA110P
i ntegrated c ircuits d ivision for additional information please visit our website at: www.ixysic.com 9 lba110 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-lba110-r09 ?copyright 2012, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/22/2012 mechanical dimensions dimensions mm (inches) notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) user direction of feed p = 12.00 (0.472) w = 16.00 (0.63) bo = 10.30 (0.406) ao = 10.30 (0.406) k 1 = 2.00 (0.079) k 0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157) dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 481-2 2. tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406) lba110str tape & reel LBA110Ptr tape & reel
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